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If the DuPont Kevlar filaments are added, then the resulting material will have a very low coefficient of thermal expansion (CTE)This is useful for mounting ceramic packages and for direct attachment of flip-chip integrated circuits The structure can be as simple as a two-sided PCB or as complex as a many-layered PCB The vias consist of a copper-epoxy paste that connects the top and bottom copper foil If used as a prepreg layer without copper, the vias connect the various ALIVH layer pairs into a multilayer structure This is not a sequential build-up process, but rather a parallel build-up process 233292 Manufacturing Process The ALIVH process is shown in Fig 2322 The process starts with an epoxy-aramid B-stage prepreg The laser cutting of holes can proceed very rapidly.

The material is then printed with a conductive paste of copper and epoxy to fill these holes Copper foil is applied and the structure is laminated to attach the foil and cure the prepreg and conductive pastes that serve as vias The sheet of material is imaged and etched to provide the various circuits Registration is less critical because the vias are now under the surface lands Several of these two-sided layer pairs can be produced, inspected, and tested The two-sided structures can then have additional single layers of B-stage/conductive paste layers with foil laminated to one or both sides, or the B-stage/conductive paste layer can be used to attach a number of layer pairs in one parallel lamination The outside is imaged, etched, and completed as a normal PCB..

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An advanced manufacturing process results in a product known as ALIVH-FB. This product has a fine-line, tight via structure suitable for wire-bonding and flip-chip substrates, as shown in Fig. 23.23. The manufacturing process for each microvia technology begins with a base core, which may be a simple double-sided board carrying power and ground planes or a multilayer board carrying some signal pattern in addition to power and ground planes. The core usually has PTHs, which become blind via holes (BVHs). Such a core is often called an active core. In fabricating a base core with a pattern, manufacturers usually panel-plate the core panel and create the pattern through a dry-film tenting process. Some makers seem to prefer pattern plating, however. The choice depends on the fabricator s familiarity with these processes. After the pattern is formed, dielectric material is laminated over the core (in the case of prepreg, with copper foil) and the holes can be filled with resins, depending on the plated hole diameter and the thickness of the core. It is generally agreed that when the diameter of plated holes is equal to or less than 0.3 mm and the core thickness is equal to 0.6 mm or less, these holes can be filled effectively by the lamination process (although the resin thickness of 80 m is preferred in the case of RCC). When the diameter and thickness conditions are not met, it is necessary to fill the holes by a separate process. A screening process does this from one side of the panel with a polyester screen that has an oversized hole pattern. After filling the holes the resin is cured completely.

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